call 800.700.CHIP(2447)

manufacturing icon

Manufacturing

MMB's uses fine-pitch surface-mount technology production on its high-speed fully automated lines. The company exclusively uses a "no-clean" solder process and convectional reflow-ovens that are environmentally safe and assure high quality.

horizontal dashed line

Computerized Manufacturing machine

memory chips

Design
Micro Memory Bank has a wide variety of module designs that include 30 and 72 Pin SIMMs, 144 SO-DIMMs, 168, 184, and 200 Pin DIMMs. Our product-line offers many older form-factors as well as leading-edge modules.

Testing
All of MMB's products are subject to strict functional testing. Module memory testers can support a wide spectrum of technology from older fast-page mode and more recent DDR technology. Product is tested "at-speed" guaranteeing maximum system performance. Gravity-feed module handlers minimizes human handling and electro-static issues.

Our motherboard system-test process is performed on all newly developed products. It is another way we assure that our production testing exceeds the customers' application demands.

test approval graphic

divider

Design Support
Engineering : Micro Memory Bank's engineering provides custom design on most desired memory modules. We can be very aggressive with design parameters; basically if it can be fabricated at the PCB house then we can design it. Our vertical process include: layout, PCB fabrication, test adopter build (if necessary), parts procurement, prototype build and a final production lot release. Designs and production releases include a bill-of-material, assembly, PCB fabrication and optional SPD drawings.

Layout Guidlines / Number of Layers :

  • 1. Component & Solder Side
  • 2. Inner Power & Ground Layers
  • 3. Unlimited number of layers, based on technical specifications and requirements

*Board Size(max): 32 x 32 inches

Design Guidelines :

  • 1. Standard trace width: 0.006"; advanced: 0.003"
  • 2. Standard spacing width: 0.006"; advanced: 0.004"
  • 3. Standard hole (min.) e.g. 0.050"; thick board: 0.012 advanced: 0.008"
  • 4. Standard pad size (min.): 0.026"; advanced 0.016"

Special Expertise :
Extensive experience with memory modules and test-load boards. Flash memory high-speed modular sub-system designs.

Design Software :

  • 1. Layout: ORCAD and PowerPCB (formally PADs)
  • 2. Support spec sheets: ORCAD and AutoCAD
  • 3. Hyperlynx's Simulation Signal Integrity Tools for EMC FCC approval.

*Typical Lead times: One week.